AMD X570 Creators Motherboard with unique VisionLINK I/O design, Effective thermal solution, Wi-Fi 6 802.11ax and Intel® 2.5GbE LAN, PCIe® 4.0 x16 slots, Quad NVMe PCIe® 4.0 x4 M.2 Connectors, USB 3.2 Gen 2x2 Type-C®

Advance Information*

GIGABYTE AMD X570 Creators Motherboard

Overview:

The GIGABYTE AMD X570 Creators Motherboard is engineered to provide uncompromising performance and cutting-edge connectivity for power users, creators, and enthusiasts who demand the best from their computing hardware. Featuring the unique VisionLINK I/O design, this motherboard brings together a host of advanced features, including robust support for the latest AMD Ryzen™ processors, ultra-fast NVMe storage options, comprehensive connectivity solutions, and an effective thermal solution to ensure optimal performance under the most demanding conditions.

Key Features:

1. Processor Support:

2. Compatible with AMD Ryzen™ 5000 series, Ryzen™ 5000 G series, Ryzen™ 4000 G series, Ryzen™ 3000 series, Ryzen™ 3000 G series, RYZEN 2000 series, and Ryzen™ 2000 G series processors.

3. Memory:

4. Dual Channel ECC/Non-ECC Unbuffered DDR4 memory with 4 DIMM slots.

5. Support for high-frequency memory modules to enhance system performance and stability.

6. VisionLINK I/O Design:

7. Simplifies connectivity and improves workflow by integrating display, data, and power into a single USB Type-C® cable.

8. Reduces cable clutter and enhances the user experience for creators and professionals needing a seamless multi-device setup.

9. Network Connectivity:

10. High-bandwidth, low-latency networking powered by Intel® 2.5GbE LAN.

11. Includes Wi-Fi 6 (802.11ax) support with 2x2 MIMO configuration and innovative antenna design for better coverage and increased signal strength.

12. Connectivity:

13. Front and rear USB 3.2 Gen 2x2 Type-C® connectors for ultra-fast data transfer speeds.

14. Comprehensive USB connectivity ensures compatibility with a wide range of peripherals and devices.

15. Storage:

16. Four ultra-fast NVMe PCIe x4 M.2 connectors, each with their own unique thermal guards to prevent throttling and maintain peak performance.

17. Support for PCIe® 4.0 to ensure future-proofing and compatibility with the fastest storage solutions available.

18. Thermal Solution:

19. Advanced thermal design featuring effective heat dissipation mechanisms, including multiple thermal guards, heat pipes, and strategically placed heatsinks.

20. Smart Fan 6 technology with hybrid fan headers and multiple temperature sensors for customized fan settings and optimal cooling performance.

21. PCIe Expansion:

22. PCIe® 4.0 x16 slots for leading-edge graphics card support and enhanced system performance.

23. Robust build quality ensures durability and reliability for demanding computing environments.

24. Q-Flash Plus:

25. Allows BIOS updates without the need to install CPU, memory, or graphics cards, simplifying the upgrade process and enhancing user convenience.

Detailed Specifications:

Processor:

• Supports AMD Ryzen™ 5000 series CPUs.
• Compatible with AMD Ryzen™ 5000 G series, Ryzen™ 4000 G series, Ryzen™ 3000 series, Ryzen™ 3000 G series, Ryzen™ 2000 series, and Ryzen™ 2000 G series processors.

Memory:

• Type: DDR4
• Configuration: Dual Channel
• ECC Support: Yes, ECC and Non-ECC Unbuffered
• Slots: 4 DIMMs
• Capacity: Support for high-capacity memory modules to enhance system scalability.

Storage:

• M.2 Slots: 4 x NVMe PCIe 4.0 x4
• Thermal Guards: Integrated on each slot to ensure minimal throttling and maintained performance.

Network:

• Ethernet: Intel® 2.5GbE LAN
• Wireless: Wi-Fi 6 (802.11ax) with 2x2 MIMO and advanced antenna design for superior signal reception and coverage.

USB Connectivity:

• Front I/O: USB 3.2 Gen 2x2 Type-C®
• Rear I/O: USB 3.2 Gen 2x2 Type-C®
• Additional Ports: Multiple USB 3.2 Gen 2, Gen 1, and USB 2.0 ports for comprehensive device connectivity.

Expansion Slots:

• PCIe Slots: 3 x PCIe 4.0 x16 slots providing support for high-performance graphics cards and additional expansion options.

Audio:

• High-definition audio subsystem with audio capacitors and noise isolation for premium sound quality.

Cooling:

• Smart Fan 6: Features hybrid fan headers and numerous temperature sensors for detailed fan mode configuration ensuring optimal cooling performance.

Motherboard Layout:

• Designed for easy installation and optimal component placement for enhanced stability and usability.